AMD on Thursday gave a sneak peek (opens in new tab) at its next-generation high-end platforms for its upcoming Ryzen 7000-series (Raphael) Zen 4 processors in AM5 form-factor together with its motherboard partners. Since AMD’s X670 and X670E platforms will cater to enthusiasts, they will pack the most innovative features as well as provide advanced overclocking capabilities. AMD’s X670 and X670E Platforms First and foremost, AMD confirmed that high-end AM5 motherboards for next-generation processors would utilize its X670 and X670E chipsets. The X670 will support overclocking and appease ‘regular’ enthusiasts. In contrast, the X670E ( dual-chip design ) features ‘unparalleled’ expandability, extreme overclocking, and PCIe 5.0 connectivity for up to two graphics cards and an M.2 slot for an NVMe SSD. AMD itself outlines several key features of its AM5 platforms that will differentiate them from previous-generation motherboards, including TDP of up to 170W to maximize the performance of next-generation processors with up to 16 Zen 4 cores, up to 24 PCIe 5.0 lanes (x16 for a graphics card, x4 for an SSD, and x4 to connect to the chipset), dual-channel DDR5 memory support, up to four DisplayPort 2 or HDMI 2.1 outputs (which confirms that there will be AM5 processors with… Read full this story
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