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M720q intel coffee lake b360 es tiny t

What to expect from CES 2021: Samsung TVs, laptops, and Galaxy S21?

January 8, 2021 by www.digitaltrends.com Leave a Comment

CES hasn’t been a big mobile show for a few years, but there are still plenty of products and innovations to be seen that point to upcoming trends — including the new Motorola G Series. Lots of big names are likely skipping CES entirely, but they weren’t likely to give us big announcements in any case. So what should you expect from mobile at CES? The angle is really about seeing new component innovations like cameras, screens, and sensors that could make it into the next generation of phones, tablets, and foldables. It’s easy to expect new lower-end and value-focused phones that will round out a company’s portfolio for the year. But that could all be turned on its head if rumors hold that Samsung will tease the upcoming Galaxy S21 during the show. … [Read more...] about What to expect from CES 2021: Samsung TVs, laptops, and Galaxy S21?

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Microsoft launches new sub-$300 laptops to fight Chromebooks for the classroom

January 19, 2021 by www.digitaltrends.com Leave a Comment

With classrooms still highly dependent on remote learning, Microsoft has announced a series of new and extremely cheap Windows 10 laptops. The devices include laptops under or around $300, some of which even support LTE connections to improve videoconferencing and online collaboration. … [Read more...] about Microsoft launches new sub-$300 laptops to fight Chromebooks for the classroom

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Issues with Chip Packaging to Affect Supply of Client Processors in 2021

January 20, 2021 by www.tomshardware.com Leave a Comment

Different chips use different types of packaging. Small integrated circuits (ICs) that do not require a complex power supply and do not need many input/output pins tend to use cheap wirebond packages. More complex devices use leadframe packages (quad flat packages (QFP), quad/dual flat no-lead packages (QFN/DFN), thin small outline profile packages (TSOP), etc.), which are generally wirebond packages encapsulated into plastic or other types of mold for added rigidity and reliability.  … [Read more...] about Issues with Chip Packaging to Affect Supply of Client Processors in 2021

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